The ADG608 and ADG609 are monolithic CMOS analog multiplexers comprising eight single channels and four differential channels respectively, fully specified for ±5 V, +5 V and +3 V
power supplies. The ADG608 switches one of eight inputs to a common output as determined by the 3-bit binary address lines A0, A1 and A2. The ADG609 switches one of four differential
inputs to a common differential output as determined by the 2-bit binary address lines A0 and A1. An EN input on both devices is used to enable or disable the device. When disabled, all
channels are switched OFF. All the address and enable inputs are TTL compatible over the full specified operating temperature range, making the parts suitable for bus-controlled systems
such as data acquisition systems, process controls, avionics and ATEs since the TTL compatible address inputs simplify the digital interface design and reduce the board space requirements.
The ADG608/ADG609 are designed on an enhanced LC2MOS process that provides low power dissipation yet gives high switching speed and low on resistance. Each channel conducts
equally well in both directions when ON and has an input signal range which extends to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All channels exhibit
break-before-make switching action preventing momentary shorting when switching channels. Inherent in the design is low charge injection for minimum transients when switching the
digital inputs.
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Automatic Test EquipmentData Acquisition SystemsCommunication SystemsAvionics and Military SystemsMicroprocessor Controlled Analog SystemsMedical InstrumentationBattery Powered InstrumentsRemote Powered EquipmentCompatible with 65 V DACs and ADCs such as AD7840/8, AD7870/1/2/4/5/6/8
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+3 V, +5 V, 65 V Power SuppliesVSS to VDD Analog Signal RangeLow On Resistance (30 V max)Fast Switching TimestON 75 ns maxtOFF 45 ns maxLow Power Dissipation (1.5 mW max)Break-Before-Make ConstructionESD > 5000 V as per Military Standard 3015.7TTL and CMOS Compatible Inputs
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(TA = +25°C unless otherwise noted)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +13 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +6.5 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to 6.5 V
Analog, Digital Inputs2 . . . . . . . . . . . . . . 0.3 V to VDD + 2 V
or 20 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle Max) . . . . . . . . . . 40 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . 40°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . 55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package
qJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 117°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . +260°C
qJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 77°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
TSSOP Package
qJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 158°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >5000 V
Post a Buying Lead
Required Field 
